AMERICAN Elements ®
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UN-Quantity
DOT, IMDG, IATA
UN2803
UN proper shipping title
DOT
IMDG, IATA
GALLIUM
Transport hazard class(es)
DOT
Class
eight Corrosive substances.
Label
eight
Class
eight (C10) Corrosive substances
Label
eight
IMDG, IATA
Class
eight Corrosive substances.
Label
eight
Packing group
DOT, IMDG, IATA
III
Environmental hazards:
N/A
Particular precautions for consumer
Warning: Corrosive substances
Transport in bulk in response to Annex II of MARPOL73/78 and the IBC Code
N/A
Transport/Further info:
DOT
Marine Pollutant (DOT):
No
UN “Mannequin Regulation”:
UN2803, Gallium, 8, IIl
Info on basic bodily and chemical properties
Appearance:
Kind: Strong in numerous kinds
Color: Silver grey
Odor: No knowledge out there
Odor threshold: No data available.
pH: N/A
Melting level/Melting vary: 29.Eight °C (86 °F)
Boiling point/Boiling vary: 2403 °C (4357 °F)
Sublimation temperature / begin: No data obtainable
Flammability (stable, fuel)
No knowledge accessible.
Ignition temperature: No knowledge accessible
Decomposition temperature: No knowledge obtainable
Autoignition: No knowledge out there.
Danger of explosion: No data available.
Explosion limits:
Lower: No knowledge accessible
Higher: No data available
Vapor pressure: N/A
Density at 20 °C (68 °F): 5.91 g/cm3 (49.319 lbs/gal)
Relative density
No information accessible.
Vapor density
N/A
Evaporation charge
N/A
Solubility in Water (H2O): Insoluble
Partition coefficient (n-octanol/water): No data obtainable.
Viscosity:
Dynamic: N/A
Kinematic: N/A
Different information
No data available
Within the solid state, the metallic exhibits a number of peculiarities. Although it is comparatively gentle, compact items disintegrate into high-quality, sharp splinters when subjected to robust mechanical stress. In the liquid state, gallium types a gentle grey lubricant movie on the skin in addition to within the eyes. Subsequently, unprotected contact with the metallic must be averted. Chemically, the coveted technology steel behaves equally to aluminium or zinc.
Dr. Mackie is an electronics industry knowledgeable with a technical background in physical chemistry, floor chemistry, rheology, and semiconductor fabrication and assembly materials and processes. His professional experience covers all facets of electronics manufacturing from wafer fabrication to semiconductor packaging and SMT/electronics assembly. In his present function, he is focused on figuring out thermal materials wants and developments for varied high-efficiency applications, as well as the development and testing of progressive options to meet the rising thermal interface materials requirements. Dr. Mackie has been an invited international keynote speaker and has lectured internationally on topics ranging from sub-ppb metals evaluation in supercritical carbon dioxide to solder paste rheology. He holds patents in novel polymers, heterogeneous catalysis, and solder paste formulation. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master’s of Science (MSc) in colloid and interface science from the College of Bristol, UK.
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